Low loss electrical applications, MEMS, anodic bonding and for optical applications.
Density (at 207 °C/68 °F): 2.13 g/cm3
Thermal Coefficient of Expansion (0/300 °C; 32/572 °F):
32 x 10-7/°C;
17.7 x 10
-7/°F
Strain Point: 456°C/ 853°F
Annealing Point: 496°C/925°F
Softening Point: NOT MEASURABLE
Refractive Index (l=589,3nm): 1.469
Optical transmission
Hydrolytic resistance: class 2
Acid resistance: class 2
Dielectric Constant: E= 4.0
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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