Precision Hole Drilling of Substrates and Windows

Ultrasonic rotary drilling of hard, brittle non-metallic materials is now available from Valley Design. This precision hole drilling service produces stress-free holes which are devoid of microscopic cracks or fissures.

When drilling brittle and hard materials such as glass or ceramics, they will often overheat and fracture due to stresses associated with ordinary rotational drilling or laser cutting methods. Substrates, windows and wafers of all types may be ultrasonically drilled including glass, ceramics, quartz, 96% and 99.6% Alumina, and Aluminum Nitride. The smooth, controlled cutting action of a lubricated ultrasonic rotary drill plus a water coolant reduces diamond tool binding. This enables faster, more efficient cutting using lighter tool pressure than with conventional machining. The lighter tool pressure simplifies drilling small diameter holes, long and deep holes, and adjacent holes close together all producing superior results. Less friction also reduces the stress imposed on the material caused by conventional diamond tool machining.

Other drilling services are also available from Valley Design including conventional diamond drilling and diamond core drilling.

Capabilities:

• Ultrasonic Hole diameters from .020" - .500"
• Conventional diamond drilling of hole diameters as small as .008"
• Up to 1" depths
• Hole placement tolerance ± .0002"
• X and Y digital readouts .0001" resolution
• Sapphire, Glass, Fused Silica, Quartz, Silicon, Ceramics, AlN, 96% and 99.6% Alumina and others can be drilled, lapped, polished and shaped.

Return to Home Page Optical polishing, lapping, dicing and optical components polishing

Updated: 27 September 2008

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