CMP Polishing of silicon, germanium, GaAs, GaP

CMP Semiconductor Material Polishing

CMP semiconductor polishing from Valley Design Corp. with large enough equipment to handle 300 mm wafers.

These machines utilize the most advanced hydroplane polishing techniques and are ideal for Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), Gallium Phosphide (GaP), and other semiconductor and optical materials.

Custom single and double side polishing of all semiconductor and optoelectronic materials for:

  • MEMS
  • Ultra-thin wafers
  • Anodic bonding
  • SOI

Other CMP polishing related Web sites:


Contact Valley Design for all your polishing needs!

 

 

 

 

 

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Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Phone: 978.425.3030
Fax: 978.425.3031

Valley Design
West 
Santa Cruz, CA 95060 
Phone: 831.420.0595 
Fax: 831.420.0592



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