CMP Semiconductor Material Polishing


CMP semiconductor polishing from Valley Design Corp. with large enough equipment to handle 300 mm wafers.

These machines utilize the most advanced hydroplane polishing techniques and are ideal for Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), Gallium Phosphide (GaP), and other semiconductor and optical materials.

Custom single and double side polishing of all semiconductor and optoelectronic materials for:

Other CMP polishing related Web sites:

  • www.valleydesign.com/optical-grade-silicon.htm Optical Grade Silicon
  • www.valleydesign.com/shaping.htm Semiconductor Material shaping
  • www.valleydesign.com/pr5.htm Electro-optical materials
  • www.valleydesign.com/pr10.htm Silicon wafer and die thinning, backlapping and polishing
  • www.valleydesign.com/pr13.htm Polished Silicon wafers, substrates, windows and plates

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    Contact Valley Design for all your polishing needs!

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    		 Corporate Headquarters
    Valley Design West Valley Design East
    151-D Harvey West Blvd.
    		Two Shaker Road, Bldg. E-001
    Santa Cruz, CA 95060 Shirley, MA 01464
    West E-mail: west@valleydesign.com East E-mail: east@valleydesign.com
    Phone: 831-420-0595 Phone: 978-425-3030
    Fax: 831-420-0592 Fax: 978-425-3031
     Return to top of page Last updated: 10 January 2006