Wafer chucks, also referred to as vacuum chucks, can be reconditioned when worn or do not meet user's needs for flatness, parallelism or level of surface defects.
In dicing operations chucks are easily damaged. Harsh environment, continuous use and accidents all contribute to dicing chuck damage. Most chucks can be restored to the original or tighter tolerance condition. Turnaround time of one to several days (depending on size and complexity of the part) will keep your machine downtime to a minimum.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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