This laser slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.
Laser slag can be and often is removed manually but it is inconsistent and if properly done, costly.
Valley Design Corp. has developed a unique process that could solve your lasered or diamond cut substrates edge and cut-out contouring problems.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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