Lasered Substrate Chamfering and Beveling

Laser slag associated with laser drilled holes is unwanted raised material remaining on the top surface and inside the holes as a result of the lasering process.

This laser slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.

Laser slag can be and often is removed manually but it is inconsistent and if properly done, costly.

Valley Design Corp. has developed a unique process that could solve your lasered or diamond cut substrates edge and cut-out contouring problems.

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Valley Design West Valley Design East
151-D Harvey West Blvd.
Two Shaker Road, Bldg. E-001
Santa Cruz, CA 95060 Shirley, MA 01464
West E-mail: west@valleydesign.com East E-mail: east@valleydesign.com
Phone: 831-420-0595 Phone: 978-425-3030
Fax: 831-420-0592 Fax: 978-425-3031
 Return to top of page Last updated: 11 January 2006