Lasered Substrate Chamfering and Beveling

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Laser slag associated with laser drilled holes is unwanted raised material remaining on the top surface and inside the holes as a result of the lasering process.

This laser slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.

Laser slag can be and often is removed manually but it is inconsistent and if properly done, costly.

Valley Design Corp. has developed a unique process that could solve your lasered or diamond cut substrates edge and cut-out contouring problems.

Return to Home Page Optical polishing, lapping, dicing and optical components polishing

Updated: 27 September 2008

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Valley Design Corp. - West
151-D Harvey West Blvd.
Santa Cruz, CA 95060
Affiliate Sites Valley Design Corp. - East
Two Shaker Road, Bldg. E-001
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West E-mail: west@valleydesign.com
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France Sales: france@valleydesign.com
Phone: 978.425.3030
Fax: 978.425.3031
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