Lasered Substrate Chamfering and Beveling
Laser slag associated with laser drilled holes is unwanted raised material remaining on the top surface and inside the holes as a result of the lasering process.
This laser slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.
Laser slag can be and often is removed manually but it is inconsistent and if properly done, costly.
Valley Design Corp. has developed a unique process that could solve your lasered or diamond cut substrates edge and cut-out contouring problems.
- Edge rounding, chamfering, blending, and polishing
- Laser slag removal - click here for more information
- Sharp corner rounding and deburring
- Prepare edges for circuit wrap-around applications
- Enhanced - via edge rounding and contouring
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