Lasered Substrate Chamfering and Beveling

Laser slag associated with laser drilled holes is unwanted raised material remaining on the top surface and inside the holes as a result of the lasering process.

This laser slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.

Laser slag can be and often is removed manually but it is inconsistent and if properly done, costly.

Valley Design Corp. has developed a unique process that could solve your lasered or diamond cut substrates edge and cut-out contouring problems.

• Edge rounding, chamfering, blending, and polishing
• Laser slag removal - click here for more information
• Sharp corner rounding and deburring
• Prepare edges for circuit wrap-around applications
• Enhanced - via edge rounding and contouring

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Sales and Customer Service	Site Map	Corporate Headquarters
Valley Design West		Valley Design East
151-D Harvey West Blvd.		Two Shaker Road, Bldg. E-001
Santa Cruz, CA 95060		Shirley, MA 01464
West E-mail: west@valleydesign.com		East E-mail: east@valleydesign.com
Phone: 831-420-0595		Phone: 978-425-3030
Fax: 831-420-0592		Fax: 978-425-3031

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Last updated: 11 January 2006