Valley Design has expanded their materials processing department and is now offering dicing and backgrinding services to the electro-optical industry and can deliver parts in 24 hours, when necessary on East and West coasts.
Whether it is Silicon (up to 6" diameter), Quartz, Ceramic, Sapphire, Alumina, Titanium, Carbide, Ferrite or any other material that is diceable, Valley Design has the latest state of the art equipment for the job.
Chips as small as .005" square can be diced from substrates as large as 6" square. Valley even has dicing saws that can accommodate parts that are 6" by 18". The dicing saws are equipped with microprocessors and closed circuit TV microscopes, all coordinated in the hands of skilled operators.
Valley Design also excels in backgrinding, lapping and polishing glass, Silicon, Aluminum Nitride, Fused Silica and Quartz substrates.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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Valley Design Corp. - West 151-D Harvey West Blvd. Santa Cruz, CA 95060 |
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Valley Design Corp. - East Two Shaker Road, Bldg. E-001 Shirley, MA 01464 |
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West E-mail:
west@valleydesign.com Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 831.420.0595 Fax: 831.420.0592 |
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east@valleydesign.com Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 978.425.3030 Fax: 978.425.3031 |
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