Lapping, backlapping, thinning and polishing of MEMS, silicon and other semiconductor materials in prototype and production quantities. Customer supplied wafers in sizes up to 12" diameter, can be lapped on one or both sides. Finished singulated dice can be thinned to 100 microns or less without edge deterioration.

During backlapping, the circuit side of the wafer or diced chip can be protected by various compatible processes. The finished wafers can be returned in wafer boats or even mounted on individual carriers for further processing by the customer. Thickness tolerances as close as ±0.0001" are possible, and parts can be lapped to as thin as 0.001 inches.

If your needs include MEMS, SOI, SDB, WDB or CMP, Valley may have the right process to resolve your specific requirements.

Information on other related processes:
· www.ultra-thin.com/mems.htm 
MEMS and bonded SOI ultra-thin Silicon wafers
· www.siliconwafers.net/thinned.htm 
Silicon wafers thinned to produce thinner dice-chips
· www.valleydesign.com/pr8.htm 
Polished glass wafers and substrates to SEMI standards
· www.ultra-thin.com/thin-optics.htm 
Thin optical glass windows, wafers, plates and sheets