Substrate Slag Removal and Chamfering

Valley Design Corp. has developed a proprietary process utilizing precisely graded pure Aluminum Oxide micro-abrasive powder as the vehicle for laser slag removal and edge rounding on substrates and laser holes.

By various masking techniques, more material can be removed from one side than from the other, and on substrate edges, it is possible to round one or more edges and leave other edges sharp. The degree of rounding is controllable as well. This process can be used to clean slag from one or both sides and to chamfer rectangular or round holes or any shapes.

Each of these benefits is available without the usual risks associated with high velocity blasting techniques. This process is adaptable to most materials including:

Return to Home Page


Sales and Customer Service
Site Map
Corporate Headquarters
Valley Design West Valley Design East
151-D Harvey West Blvd.
Two Shaker Road, Bldg. E-001
Santa Cruz, CA 95060 Shirley, MA 01464
West E-mail: west@valleydesign.com East E-mail: east@valleydesign.com
Phone: 831-420-0595 Phone: 978-425-3030
Fax: 831-420-0592 Fax: 978-425-3031
 Return to top of page Last updated: 11 January 2006