Strips up to 14" long can be accommodated, as well as wafers up to 14" in diameter with a <10 Angstrom or 1 nm surface finish or better. Round 2" to 6" Silicon wafers are polished routinely.
This service is the company's latest addition to their precision lapping, polishing, backlapping and dicing capabilities. Similar processes are available for other semiconductor materials. Valley Design is equipped to meet even the most demanding thickness tolerance and parallelism specifications.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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Valley Design Corp. - West 151-D Harvey West Blvd. Santa Cruz, CA 95060 |
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Valley Design Corp. - East Two Shaker Road, Bldg. E-001 Shirley, MA 01464 |
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West E-mail:
west@valleydesign.com Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 831.420.0595 Fax: 831.420.0592 |
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east@valleydesign.com Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 978.425.3030 Fax: 978.425.3031 |
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