Polishing of Silicon Wafers

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Valley Design Corp. has expanded their precision polishing of semiconductor materials to include large Silicon substrates. In a recent job, 6 Silicon strips were sliced to 2" wide x 12.5" long, lapped and polished to a 10/5 scratch/dig surface finish.

Strips up to 14" long can be accommodated, as well as wafers up to 14" in diameter with a <10 Angstrom or 1 nm surface finish or better. Round 2" to 6" Silicon wafers are polished routinely.

This service is the company's latest addition to their precision lapping, polishing, backlapping and dicing capabilities. Similar processes are available for other semiconductor materials. Valley Design is equipped to meet even the most demanding thickness tolerance and parallelism specifications.

Return to Home Page Optical polishing, lapping, dicing and optical components polishing

Updated: 27 September 2008

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Valley Design East
Two Shaker Road, Bldg. E-001
Shirley, MA 01464
Phone: 978.425.3030
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