A recently developed process allows us to dice thick wafer stacks. This new service is now being offered by Valley Design Corp. Beyond our normal services for dicing Silicon, Ceramics, Glass, Quartz and other electro-optical materials.
Valley Design has developed a process for dicing multi-layer Silicon stacks up to 0.170" thick. A typical stack might consist of 16 layers of Silicon -- diced into chips as small as 0.062" sq. This could produce a voltage rectifier up to 2400 volts. Kerf loss is kept to the absolute minimum with thin blades, .010" to .025".
The most rigorous customer standards are maintained.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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