Various windows, plates and disks that can be optically polished to better than 0.5 microinches (20/10), are excellent as substrates and also in semiconductor form for applications such as: resistor networks, thin and thick film microelectronics, vacuum vapor and sputtering depositions, photomasks, electro optics, semiconductor monitor wafers and other precision optical components.
All data is subject to normal manufacturing variations and is provided for reference purposes only. Customers are responsible for selecting the suitability of material for their intended application.
Mirrors, microslides, printed circuit substrates and electronic applications
Density (at 20º C/68 ºF):
2.44 g/cm³
Thermal Coefficient of Expansion: (0/300 °C)
8.6 x 10-6/°C
Strain Point: 490°C/ 914°F
Annealing Range:480°C-575°C/896°F-1067°F
Softening Point: 575°C/1067°F
Refractive Index (l=435): 1.523
(l=645)=1.513
Optical transmission
Hydrolytic resistance: class 3
Dielectric Constant: E= 7.75
Filter lens, sheet glass, tubing
Density (at 20º C/68 ºF):
2.23 g/cm³
Thermal Coefficient of Expansion (0/300 °C):
32.5 x 10-7/°C
Strain Point: 510°C/950°F
Annealing Point: 560°C/1040°F
Softening Point: 821°C/1509.8°F
Refractive Index(l=589.3nm): 1.473
Optical transmission
Hydrolytic resistance: class 1
Acid resistance: class 1
Alkali resistance: class 2
Dielectric Constant: E= 4.6
Substrates for flat panel displays
Density (at 25º C/77 ºF):
2.54 g/cm³
Thermal Coefficient of Expansion (0/300 °C; 32/572 °F):
37.6 x 10-7/°C;
21 x 10-7/°F
Strain Point: 666°C/1231°F
Annealing Point:721°C/1330°F
Softening Point:975°C/1787°F
Refractive Index (l=656.3nm): 1.5160
(l=435.8nm): 1.5290
Optical transmission
Dielectric Constant: E= 5.7
Low loss electrical applications
Density (at 20º C/68 ºF):
2.13 g/cm³
Thermal Coefficient of Expansion (0/300 °C; 32/572 °F):
32 x 10-7/°C;
17.7 x 10-7/°F
Strain Point: 456°C/ 853°F
Annealing Point: 496°C/925°F
Softening Point: NOT MEASURABLE
Refractive Index (l=589,3nm): 1.469
Hydrolytic resistance: class 2
Acid resistance: class 2
Dielectric Constant: E= 4.0
Density (at 20º C/68 ºF):
2.51 g/cm³
Thermal Coefficient of Expansion (20/300 °C):
7.0 x 10-6/°C
Strain Point:°C/ °F
Annealing Point:°C/ °F
Softening Point:°C/ °F
Refractive Index (l=582.1nm): 1.509
Optical transmission
Hydrolytic resistance: class 2
Acid resistance: class 1
Alkali resistance: class 2
Dielectric Constant: E=
LCD, solar cells, hybrid circuits, CCD covers, electroluminescent displays
Density (at 20º C/68 ºF):
2.72 g/cm³
Thermal Coefficient of Expansion (20/300 °C):
4.5 x 10-6/°C
Strain Point: 627°C/1161°F
Annealing Point: 663°C/1225°F
Softening Point: 883°C/1621°F
Refractive Index(l=588nm): 1.5255
Optical transmission
Dielectric Constant: E= 6.2
Touch control panels, LCD, solar cells, electroluminescent displays
Density (at 20º C/68 ºF):
2.51 g/cm³
Thermal Coefficient of Expansion (20/300 °C; 68/572 °F): 8.6 x 10 -6/°C
Strain Point: 529°C/984°F
Annealing Point: 557°C/1035°F
Softening Point: 736°C/1357°F
Refractive Index (l=546nm): 1.5255
(l=588nm): 1.5230
Optical transmission
Hydrolytic resistance: class 1
Dielectric Constant: E= 6.7
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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