Ultra-Thin Silicon and Gallium Arsenide

Valley Design Corporation has developed a process and is supplying on a regular basis, ultra-thin Silicon and GaAs (with circuitry) precision lapped or (CMP), chemically-mechanically polished.

Substrates as thin as 10 microns thick with circuitry were completed. A recent order called for 5" diameter wafers of 3 mil thickness (polished on both sides). Valley Design offers a complete line of lapped, polished and diced substrates, Sapphire, Glass, flat optical pieces and other electro-optical materials.

Note: Approximate optical scratch/dig and Ra relationship for surface finishes.

Wafer, chip, dice, die thinning related Web sites:

• www.valleydesign.com/pr26.htm Thin Ceramics and thin Ceramic substrates and wafers
• www.valleydesign.com/pr10.htm Silicon wafer and die thinning, backlapping and polishing
• www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing
• www.ultra-thin.com/sitemap.htm Ultra-thin glass, wafer and chip site map

Return to Home Page Optical polishing, lapping, dicing and optical components polishing

Updated: 27 September 2008

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