Precision Dicing, Production Dicing, Contract Dicing

Precision dicing capabilities at Valley Design Corp now include metallic materials. Rods, substrates, wafers, plates and optical components can be diced to custom specifications, with dice as small as .005"x.005" and dicing kerf as small as .001".

In addition to Sapphire, Silicon, Ceramics, Glass, and Quartz, we have the ability to dice Silicon Carbide, Iridium, Copper, Tungsten Carbide, Brass, Hafnium, Stainless Steel and many other materials. Characteristics such as rounded or chamfered corners and edges, along with good perpendicularly can be specified on any order.

Other Web sites with dicing informtion:

  • www.valleydesign.com/dice.htm Disco wafer and substrate chucks reconditioned
  • www.valleydesign.com/pr1.htm Dicing wafers, substrates, circuits and optical windows
  • www.valleydesign.com/pr8.htm Polished glass wafers and substrates to SEMI standards

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    		 Corporate Headquarters
    Valley Design West Valley Design East
    151-D Harvey West Blvd.
    		Two Shaker Road, Bldg. E-001
    Santa Cruz, CA 95060 Shirley, MA 01464
    West E-mail: west@valleydesign.com East E-mail: east@valleydesign.com
    Phone: 831-420-0595 Phone: 978-425-3030
    Fax: 831-420-0592 Fax: 978-425-3031
     Return to top of page Last updated: 20 DEC 2007