Precision Lapping of Semiconductor Materials
Silicon wafer lapping, thinning and backlapping has been performed by Valley Design Corp., an ISO 9002 company, for over twenty-five years.
Customer supplied wafers in sizes up to 12" diameter, can be lapped on one or both sides. Valley Design will protect the circuit side by various compatible processes. The lapped wafers can be shipped in wafer boats or even mounted on individual carriers for further processing by the customer.
Thickness tolerances as close as 0.0001" are possible, and semiconductor wafers can be lapped as thin as 0.001".
This service is an extension of Valley Design's custom Glass, Quartz, Ceramic, Sapphire, and metal precision lapping and polishing service. Valley also stocks many of these materials including Fused Silica, Optical glass, 99.6% Alumina, Aluminum Nitride and others.
Return to Home Page Optical polishing, lapping, dicing and optical components polishing