Semiconductor Wafer Shaping, Dicing and Polishing

• Double side polished wafers to TTV < 1 micron
• Silicon, Germanium, Gallium Arsenide, Gallium Phosphide
• Slicing to 5" diameter
• Edge grinding
• Lapping to 300 mm diameter
• Dicing to 6" diameter
• Optical grade materials
• Cylindrical grinding
• Wafer thinning/backlapping
• Complex shaping
• Surface flat orientation
• Testing for type and resistivity
• Process development and R & D

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Sales and Customer Service	Site Map	Corporate Headquarters
Valley Design West		Valley Design East
151-D Harvey West Blvd.		Two Shaker Road, Bldg. E-001
Santa Cruz, CA 95060		Shirley, MA 01464
West E-mail: west@valleydesign.com		East E-mail: east@valleydesign.com
Phone: 831-420-0595		Phone: 978-425-3030
Fax: 831-420-0592		Fax: 978-425-3031

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Last updated: 4 January 2006