Mirrors, microscopic slides, touch screens, filters, photomasks, glass masters, data storage disks, printed circuit substrates, photographic plates, substrates, wafers and optical windows
Thermal Conductivity: 0.937 W.m/m 2 °C
Density (at 20 °C/68 °F): 2.44 g/cm3
Hardness (Moh's Scale): 6 - 7
Knoop Hardness: 585 kg/mm2 + 20
Modulus of Elasticity (Young's): 7.2 x 1010 Pa
Modulus of Rigidity (Shear): 3.0 x 1010 Pa
Bulk Modulus: 4.3 x 1010 Pa
Poisson's Ratio: 0.22
Specific Gravity: 2.53
Specific Heat: 0.21
Specific Weight: 2,483 g/cm3
Thermal Coefficient of Expansion (0/300 °C):
8.6 x 10 -6/°C
Softening Point: 726°C/1340°F
Annealing Range: 546°C/1015°F
Strain Point: 514°C/957°F
Refractive Index (l=435): 1.523
(l=645)=1.513
Optical transmission
Hydrolytic resistance: class 3
Dielectric Constant: @ 20°C E= 7.75
Specific Resistivity: 1000 Hz 25°C - log R ohms/cm: 9.7
100°C: 91 - 250 °C: 6.5
60Hz 25°C: 11
Return to Home Page Optical polishing, lapping, dicing and optical components polishing
Updated: 27 September 2008
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