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Ceramic Substrates of Aluminum Nitride and Alumina
Valley Design
specializes in processing Ceramic substrates for microelectronic, thermal
management and other critical applications. Aluminum nitride and alumina
substrates can be lapped, polished, diced, grooved, drilled and shaped to
any specification.
Original surfaces
of these tape cast, as-fired substrates vary in surface finish from 2 microinches
Ra for 99.6% thin film substrates to over 30 microinches Ra for 96% thick
film and Aluminum Nitride substrates. Lapping and polishing dramatically
improve the as-fired surfaces of Ceramic materials as well as the flatness
and thickness tolerances. Holes, chamfers, grooves and other machining can
shape the product to meet customer requirements.
Aluminum Nitride
Ceramic substrates have outstanding thermal properties. These nontoxic
substrates also offer good electrical, mechanical and chemical properties
making them ideal for high power semiconductor applications. AlN is a good
choice for high performance chip carrier applications and for both large
and high power die.
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Valley Design's
lapping process will produce good surface finishes and meet any flatness
and thickness requirements.
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Our polishing
service will give surface finishes as good as 1 microinch Ra and flatness
specification measurable in light band range.
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Thinning to
only a few thousandths of an inch thick will give maximum thermal management
benefits for devices like ignition modules, power transistors, solid
state relays and motor controllers.
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For more information
on Aluminum Nitride as-fired, lapped, or polished substrates from
stock
or custom made, go to
www.aluminumnitride.com.
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99.6% Aluminum
oxide substrates are most often used in thin film applications and
are commonly referred to as thin film Ceramic substrates. In the as-fired
condition, flatness, surface imperfections, thickness tolerances and
surface finish may not meet required conditions for sensitive applications.
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Lapping provides
the desired flatness and thickness tolerance, with a surface finish
typically in the 8 to 12 microinch range.
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Polishing will
make the surface defect-free and improve the finish to 0.5 microinch
with good flatness and thickness tolerances.
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Thinning can
bring the substrate thickness down to 0.001" with either a lapped
or polished finish.
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96% Aluminum
oxide substrates, known also as thick film substrates, have similar
thickness and flatness characteristics as 99.6% Alumina in the as-fired
state. However, the surface finish for 96% Alumina may be as rough as
30 microinches.
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Our lapping
process will give any desired thickness tolerance and good flatness.
The thicker the finished substrate, the better flatness we can achieve.
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Most thick film
applications do not require polished substrates. 96% Alumina can be
polished, although not as highly as 99.6% Alumina.
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Thinning produces
parts as thin as 0.002". Thin substrates are an excellent material
for thick film chip capacitors. 4" x 4" plates can be routinely
lapped to a thickness of 0.0035" to 0.004" with a surface
finish of 15 to 20 microinches Ra.
For more information, go to:
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