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Stainless Steel Substrates and Foil
Stainless steel substrates, foils, plates and wafers in all sizes, shapes,
thicknesses and surface finishes processed to customer specifications with some
wafer sizes available from stock.
Stainless steel 304, 316, and 430 square, in geometries from round, rectangular
or odd shaped can be supplied in any thickness but more commonly 0.025"
(625 mm) and thinner (to 0.001"/25 microns) with surface finishes from as
machined to optically polished.
Polished
stainless steel substrates are commonly used for semiconductors, solar cell
manufacturing, sensor, medical and numerous other applications. For larger volume
production, foil may be the solution.
Available surfaces for stainless steel substrates, foils and wafers:
VDC Surface Finish Designations:
| VDC - 1 |
As machined/manufactured - depending on thickness
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| VDC - 2 |
Lapped surface with loose abrasive - dull, uniform finish
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| VDC - 3 |
Diamond fine lapped - shiny but slightly scratched look
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| VDC - 4 |
Standard buffed surface
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| VDC - 5 |
Fine buffed surface
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| VDC - 6 |
Polished surface
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| VDC - 7 |
Fine polished surface (80/60 scratch/dig)
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| VDC - 8 |
Optically polished surface (60/40 scratch/dig)
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| VDC - 9 |
Fine optical polished surface (40/20 scratch/dig)
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| VDC - 10 |
Best optically polished surface (20/10 scratch/dig) - 20 Angstrom Ra range |
Valley can also provide surface finish analyses and reports with our in-house
WYKO optical profilometer instrumentation. Click
here
for more information on how the WYKO works. Please call or
e-mail for
further details, or for a quotation per your specifications.
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