Thinning of silicon and GaAs wafers, substrates and dice

Ultra-Thin Silicon and Gallium Arsenide

Valley Design Corporation has developed a process and is supplying on a regular basis, ultra-thin Silicon and GaAs (with circuitry) precision lapped or (CMP), chemically-mechanically polished.

Substrates as thin as 10 microns thick with circuitry were completed. A recent order called for 5" diameter wafers of 3 mil thickness (polished on both sides). Valley Design offers a complete line of lapped, polished and diced substrates, Sapphire, Glass, flat optical pieces and other electro-optical materials.

Scratch/Dig Angstroms Ra Microinches Ra
10/5 10A .040u"
20/10 20A .080u"
40/20 30A .12u"
60/40 40A .16u"
80/50 50A .2u"

Note: Approximate optical scratch/dig and Ra relationship for surface finishes.


Wafer, chip, dice, die thinning related Web sites:







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Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Phone: 978.425.3030
Fax: 978.425.3031

Valley Design
Santa Cruz, CA 95060 
Phone: 831.420.0595 
Fax: 831.420.0592

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